We are talking therefore about processors AMD Ryzen 8000 “Granite Ridge” and “Strix Point”, and that not yet have not been released or the Ryzen 7000 yet, so there is plenty of time to do so. In any case, those of Lisa Su seem to have the plans for their next launches quite well on track, in which they hope that the period of chip shortage is already solved.
AMD relies on TSMC 3nm for its next generations
While Zen 4 is aiming to launch in 2022, the Zen 5 architecture is already scheduled for a release around 2023-2024. It appears that the transition to Zen 4 from Zen 4 would be faster than the transition from Zen 3 to Zen 4, as the report states that AMD is expected to detail its future vision (likely in the form of new roadmaps) in this Computex 2021 that has just fired the starting gun.
The design of the AMD Zen 4 is expected to be finalized in the second half of this year, and will be based on TSMC’s 5nm compute node. Meanwhile, TSMC is expected to begin mass production of its 3nm process node by the second half of 2022, with the production ramp by 2023. The process node will be used to manufacture the next-generation Zen 5 chips. from AMD on their EPYC and Ryzen processors, including 5th Gen CPU / APU EPYC «Turin», Ryzen “Granite Ridge” seventh generation and Ryzen “Strix Point” CPU / APU seventh generation.
Both Zen 4 and Zen 5 will see AMD become TSMC’s largest HPC customers in 2023 and 2024, and here’s everything we know about these new processor families.
AMD Ryzen 8000 “Granite Ridge” for Desktop CPU
AMD Ryzen “Granite Ridge” Family Will Be Part of New Zen 5 Architecture; will be compatible with the new AM5 socket in the new LGA1718 socket, and at the moment almost nothing is known about this family of processors except their names and that their Zen 5 cores will offer a great advance in CPI, efficiency, clock speed and performance over the Zen 4 cores (they will probably have a higher number of cores as well).
Like the Raphael (Ryzen 7000), the Granite Ridge desktop CPUs will also feature integrated GPUs which will be an upgraded version of the next-gen RDNA 2 or even RDNA 3 architecture. You will likely see increased I / O and possibly even the implementation of PCI-Express 5.0 to match the core Intel platform. That said, Zen 5 is still a huge mystery so it will be quite a while until we know something more concrete about the final specs and performance numbers of these new chips.
AMD Ryzen 8000 “Strix Point”, the Zen 5 APUs at 3 nm
AMD Strix Point Ryzen APUs will offer a hybrid architecture that is realized by combining two Zen core IPs; the main cores would be based on Zen 5 architecture and the rest would be Zen 4 (note that these APUs are not expected until 2024 but Zen 4 will be released sometime in 2022).
The Zen 5 and Zen 4 cores for the Strix Point APUs are claimed to be based on TSMC’s 3nm process node just like the previous ones, and the most interesting thing is that we already know that Zen 4 will be manufactured on the node of 5nm, so we could be looking for an improved version of the architecture in these APUs. The small Zen 4 cores are said to be called Zen 4D, and these APUs are expected to feature 8 Zen 5 cores and 4 Zen 4 cores in total.
A new L4 cache system will also be implemented in these Ryzen 8000 APUs that will function as a system-level cache. Rumor has it that the hybrid approach could only be a mobile-specific release, while the desktop chips will be based on the same monolithic design that we have so far, so it will be really interesting to see if AMD uses its X3D packaging technology for Strix Point APUs, as it sounds like the next logical path in developing MCM APUs.
Until now, AMD APUs have been offering a monolithic design in all their IP (CPU, GPU, IO) integrated in the same die; Technologies such as Infinity Cache and RDNA 3 are also expected to debut on these AMD Ryzen 8000 “Strix Point” APUs. Again, this is all just hearsay, but we can definitely look forward to a lot of exciting developments in the APU segment in the years to come.
AMD EPYC “Turin” for HPC and servers
The 5th generation EPYC family of processors, codenamed Turin, will replace the Genoa line but will be compatible with the SP5 platform. Turin chips could use package designs like we’ve never seen before as we know Milan-X is already real and will supposedly feature Zen 3 cores stacked on each other to increase the number of cores. However, Turin is coming years later and as such we can look forward to more futuristic packaging designs.
AMD Genoa CPUs are said to feature up to 96 PCIe 5.0 interface cores. With Turin, it is very likely that we will see a PCIe 6.0 interface and up to 128 cores on a single chip or even more if AMD opts for stacked X3D chiplets. Of course, we can’t forget about AMD’s Ryzen Threadripper line of HEDT chips, which will obviously have a big launch with the Zen 5 cores, although it is true that that line has always stayed true to the Zen product cycle, so We don’t expect that launch to happen until 2024 or even 2025.