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Delid Intel Core i9-11900K, is it easy to remove the IHS and change the TIM?

The launch of Rocket Lake-S and its processors has not been what Intel expected, since these have not meant a paradigm shift or a performance improvement to think that Comet Lake-S is not the same or a better option, or simply Zen 3. Knowing this and the temperatures reached by a top processor like this i9-11900K, remove its solder and replace it with a liquid metal TIM, is it recommended?

Delving the i9-11900K is more dangerous and complex

Intel has changed some of the internal provisions of its processors for LGA1200 and among other changes is to include some small mini SMD on the PCB or substrate of this CPU. These are physically accessible without delid, so they are on the periphery of the processor, which greatly complicates the uncapping process successfully and without breakage.

Also, they are so close to the IHS that a couple of millimeters is enough to go from being able to perform delid to having a nice expensive paperweight. As if this were not enough, Intel has improved the monolayer compound that it uses to glue the IHS to the PCB and it also seems that it has also improved the solder and its resistance once it solidifies.

As you can see in the video uploaded by the overclocker, it is not enough to have an Allen key to open the CPU and break the solder, but you have to use a torque wrench. Previously, he had to heat the CPU to soften the solder at least, which implies heating the processor above 180 degrees, a figure that is not recommended since, although it can be supported by the IHS and the die, the PCB is exposed to possible deformations in the process.

Is it worth the effort and danger for the delid?

Well, according to der8auer, change the solder for a TIM like Conductonaut It gives an improvement in the range of 10 to 12 degrees, which is about the same improvement that was seen on average when replacing the common Intel TIM with the same liquid metal compound.

To get into context, until now replacing solders with liquid metal pastes gave an average improvement between 2 and 4 degrees, in the best of cases, so these data suppose a tripling of the improvement and evidence that Intel has not made an improvement. good job with the solder or the components that make it up.

In any case, the delid process for this i9-11900K is so complicated and involves so much risk that it is totally inadvisable for inexperienced and higher-level users, as it is easy for us to run out of CPU as soon as we fail by two millimeters precision.